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Model: Circuit Board
| Item | Mass processing capability | Small batch processing capability | ||||
| Layer (Max.) | 2-28 | 26-32 | ||||
| Type of the board material |
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| Compound pressed board | 4 layers 6 layers | 6 layers 8 layers | ||||
| Maximum Size | 610mm X 1100mm | |||||
| Outline Size Tolerance | ±0.13mm | ±0.10mm | ||||
| V-CUT Deepness Tolerance | +/- 0.15 mm (V-CUT):+/- 0.1 mm (CNC V-CUT) | |||||
| BoardThicknessRange | 0.1mm--6.00mm | 0.10mm--8.00mm | ||||
| Board Thickness Tolerance( t≥0.8mm) | ±8% | ±5% | ||||
| Board Thickness Tolerance (t＜0.8mm) | ±10% | ±8% | ||||
| Medium Thickness | 0.076mm--6.00mm | 0.076mm--0.100mm | ||||
| Minimum Line Width | 0.75mm（3mil） | 0.063mm(2.5mil) | ||||
| Minimum Line Distance | 0.75mm（3mil） | 0.063mm(2.5mil) | ||||
| Line Margin | 0.2 mm (CNC) ：0.30 mm : 0.50 mm (V-CUT) | |||||
| Outer layer copper thickness | 8.75um--1050um | 8.75um--1050um | ||||
| Inner layer copper thickness | 8.75um--1050um | 8.75um--1050um | ||||
| Drill hole size (power drill) | 0.25mm--6.00mm | 0.15mm--0.25mm | ||||
| Hole size (power drill) | 0.20mm--6.00mm | 0.10mm--0.15mm | ||||
| Hole size tolerance (power drill) | +/- 0.08 mm (copper immersion hole) +/- 0.05 mm (non-copper immersion hole) +0.1/-0.05 mm (injection hole) | |||||
| Hole position deviation (power drill) | +/-0.075mm: (drill hole) : +/- 0.10 mm (injection hole) | 0.050mm | ||||
| Laser hole size | 0.10mm | 0.075mm | ||||
| Aspect Ratio | 12.5：1 | 20：1 | ||||
| Solder mask type | sensitive green, yellow, black, purple, blue ink | |||||
| Minimum width of solder mask bridge | 0.10mm | 0.075mm | ||||
| Minimum size of solder mask separation ring | 0.05mm | 0.025mm | ||||
| Taphole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm | ||||
| Impedance tolerance | ±10% | ±5% | ||||
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